Printed Circuit Board Peel Strength and Solderability Test System

Bench system combining a 90 degree peel fixture for copper foil adhesion and a solder pot for wetting checks on pads and leads. Used by PCB fabricators and electronics assembly quality laboratories.

Specification

Copper strips on laminate are peeled at 90 degrees on a small tensile frame and a separate solder bath checks wetting time of pads and leads. Both tests qualify boards before assembly.

Features

• 90 degree peel fixture with sliding stage
• Digital force gauge with peak hold
• Lead-free solder pot to 300 deg C
• Timer with dip speed control
• Specimen cutter for 3 mm strips

Technical Specifications

Peel capacity	100 N
Peel speed	50 mm/min
Solder pot temperature	Ambient to 300 deg C
Dip depth	0 to 20 mm
Dip time	0 to 30 s
Accuracy	+/- 0.5 percent
Standards	IPC-TM-650 2.4.8, IEC 61189-3, J-STD-003
Power	230 V AC, 50 Hz

Standard Accessories

• Peel fixture
• Solder pot
• Flux bottle